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specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer ' s products or equipment. to verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. any and all sanyo semiconductor co.,ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. the products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. if you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage conditi on (temperature, operation time etc.) prior to the intended use. if there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. o2611 sy 20111014-s00003/d2210 sy 20101201-s00005 no.a1902-1/14 LV5681P overview the LV5681P is a multi-power supply system ic that provides f our regulator outputs and two high side switches as well as a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. it is an optimal power supply ic for car audio and car entertainment systems and similar products. features ? four regulator output systems for microcontroller: 5.7v output voltage, 200ma maximum output current for cd drive: 7.0v output voltage, 1300ma maximum output current for illumination: 8 to 12v output voltage (output can be set with external resistors), 300 ma maximum output current for audio systems: 8 to 9v output voltage (output voltage can be set with external resistors), 300ma maximum output current ? two v cc -linked high side switch systems ext: 350ma maximum output current, 0.5v voltage difference between input and output. ant: 300ma maximum output current, 0.5v voltage difference between input and output. ? two v dd 5v-linked high side switch systems sw5v: 200ma maximum output current, 0.2v voltage difference between input and output. acc (accessory voltage detection output ): 100ma maximum output current, 0. 2v voltage difference between input and output. ? overcurrent protection function ? overvoltage protection function, typ 21v (excluding v dd 5v output) ? overheat protection function, typ 175oc ? on-chip accessory voltage detection circuit ? p-channel ldmos used for power output block caution) the protection functions are provi ded in order to improve the ability of the ics to withstand breakdown, and they are not inten ded to guarantee safety when used under conditions outside the safe operating area or rated operating conditions. use of the ics under any conditions exceeding the safe operating area or above the iomax, and especially use in overcurrent pro tection areas or under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown. monolithic linear ic for car audio systems multi-power supply system ic orderin g numbe r : ena1902a
LV5681P no.a1902-2/14 specifications absolute maximum ratings at ta = 25 c parameter conditions conditions ratings unit supply voltage v cc max 36 v peak supply voltage v cc peak see below for the waveform applied. 50 v allowable power dissipation pd max independent ic ta 25 c 1.5 w al heat sink * 5.6 w with an infinity heat sink 32.5 w junction temperature tj max 150 c operating ambient temperature topr -40 to +85 c storage temperature tstg -55 to +150 c * : when the aluminum heat sink (50mm 50mm 1.5mm) is used allowable operating range at ta = 25 c parameter conditions ratings unit operating supply voltage 1 v dd output, sw output, acc output 7.5 to 16 v operating supply voltage 2 ilm output at 10v 12 to 16 v ilm output at 8v 10 to 16 v operating supply voltage 3 audio output at 9v 10 to 16 v operating supply voltage 4 cd output ( cd output current = 1.3a) 10.5 to 16 v cd output (cd output current 1a) 10 to 16 v electrical characteristics at ta = 25c, v cc = 14.4v *: all the specifications are defined based on th e tests that tj is almost equal to ta (=25 c). to suppress the rise of tj in the junction temperature as much as possible, it tests by the pulse loading. parameter symbol conditions ratings unit min typ max current drain i cc v dd no load, ctrl1/2 = ? l/l ? , acc = 0v 400 800 a ctrl1 input low input voltage v il 1 0 0.4 v m1 input voltage v im1 1 0.8 1.1 1.4 v m2 input voltage v im2 1 1.9 2.2 2.5 v high input voltage v ih 1 2.9 3.3 5.5 v input impedance r ih 1 350 500 650 k ctrl2 input low input voltage v il 2 0 0.5 v m input voltage v im 2 1.1 1.65 2.1 v high input voltage v ih 2 2.5 3.3 5.5 v input impedance r ih 2 350 500 650 k v dd 5.7v output *1 the v dd 5.7v output supplies the output cu rrents of sw 5.7v and acc 5.7v. output voltage 1 v o 1 i o 1 = 200ma, i o 7, i o 8 = 0a 5.4 5.7 6.0 v output voltage 2 v o 1 ? i o 1 = 200ma, i o 7 = 200ma, i o 8 = 100ma 5.4 5.7 6.0 v output total current ito1 v o 1 5.4v, ito1 = i o 1+i o 7+i o 8 500 ma line regulation v oln 1 7.5v < v cc < 16v, i o 1 = 200ma *2 30 90 mv load regulation v old 1 1ma < i o 1 < 200ma *2 70 150 mv dropout voltage 1 v drop 1 i o 1 = 200ma *2 1.0 1.5 v dropout voltage 2 v drop 1 ? i o 1 = 100ma *2 0.7 1.05 v dropout voltage 3 v drop 1 ? i o 1+i o 7+i o 8 = 500ma 2.5 3.75 v ripple rejection r rej 1 f = 120hz, i o 1 = 200ma *2 40 50 db cd output ; ctrl2 = ? h ? output voltage v o 2 i o 2 = 1000ma 6.65 7.0 7.35 v *1 : the v dd 5.7v output also supplies the output currents of sw 5.7v and acc 5.7v. therefore, the current supply capability of the v dd 5.7v output and its other electrical characteristic s are affected by the output statuses of sw 5.7v and acc 5.7v. *2 : sw 5v and acc 5.7v are not subject to a load. continued on next page.
LV5681P no.a1902-3/14 continued from preceding page. parameter symbol conditions ratings unit min typ max output current i o 2 v o 2 6.65v 1300 ma line regulation v oln 2 10.5v < v cc < 16v, i o 2 = 1000ma 50 100 mv load regulation v old 2 10ma < i o 2 < 1000ma 100 200 mv dropout voltage 1 v drop 2 i o 2 = 1000ma 1.0 1.5 v dropout voltage 2 v drop 2 ? i o 2 = 500ma 0.5 0.75 v ripple rejection r rej 2 f = 120hz, i o 2 = 1000ma 40 50 db audio (8-9v) output ; ctrl2 = ? m ? audio_f pin voltage v i 3 1.222 1.260 1.298 v audio_f pin inflow current i in 3 -1 1 a audio output voltage 1 v o 3 i o 3 = 200ma, r2 = 30k , r3 = 5.6k *3 7.65 8.0 8.35 v audio output voltage 2 v o 3 ? i o 3 ? = 200ma, r2 = 27k , r3 = 4.7k *3 8.13 8.5 8.87 v audio output voltage 3 v o 3 ? i o 3 ? = 200ma, r2 = 24k , r3 = 3.9k *3 8.6 9.0 9.4 v audio output current i o 3 300 ma line regulation v oln 3 10v < v cc < 16v, i o 3 = 200ma 30 90 mv load regulation v old 3 1ma < i o 3 < 200ma 70 150 mv dropout voltage 1 v drop 3 i o 3 = 200ma 0.3 0.45 v dropout voltage 2 v drop 3 ? i o 3 = 100ma 0.15 0.23 v ripple rejection r rej 3 f = 120hz, i o 3 = 200ma 40 50 db ilm (8-12v) output ; ctrl1 = ? m1 ? ilm_f pin voltage v i 4 1.222 1.260 1.298 v ilm output voltage 1 v o 4 i o 4 = 200ma, r2 = 30k , r3 = 5.6k *3 7.65 8.0 8.35 v ilm output voltage 2 v o 4 ? i o 4 ? = 200ma, r2 = 27k , r3 = 3.9k *3 9.55 10.0 10.45 v ilm output voltage 3 v o 4 ? i o 4 ? = 200ma, r2 = 33k , r3 = 3.9k *3 11.36 11.9 12.44 v ilm output current i o 4 300 ma line regulation v oln 4 12v < v cc < 16v, i o 4 = 200ma 30 90 mv load regulation v old 4 1ma < i o 4 < 200ma 70 150 mv dropout voltage 1 v drop 4 i o 4 = 200ma 0.7 1.05 v dropout voltage 2 v drop 4 ? i o 4 = 100ma 0.35 0.53 v ripple rejection r rej 4 f = 120hz, i o 4 = 200ma 40 50 db remoto (ext) ; ctrl1 = ? m2 ? output voltage v o 5 i o 5 = 350ma v cc -1.0 v cc -0.5 v output current i o 5 v o 5 v cc -1.0 350 ma ant remoto ; ctrl1 = ? h ? output voltage v o 6 i o 6 = 300ma v cc -1.0 v cc -0.5 v output current i o 6 v o 6 v cc -1.0 300 ma sw 5v output ; ctrl2 = ? m ? output voltage 1 v o 7 i o 7 = 1ma, i o 1, i o 8 = 0a *4 v o 1-0.25 v o 1 v output voltage 2 v o 7 ? i o 7 = 200ma, i o 1, i o 8 = 0a *4 v o 1-0.45 v o 1-0.2 v output current i o 7 v o 7 4.55 200 ma acc detection ; acc integration 5v output acc detection voltage v th 8 2.75 3.0 3.25 v hysteresis width v his 8 0.2 0.3 0.4 v input impedance zi8 (pull-down resistance internal) 42 60 78 k acc output voltage 1 v o 8 i o 8 = 0.5ma, i o 1, i o 7 = 0a *4 v o 1-0.25 v o 1 v acc output voltage 2 v o 8 ? i o 8 = 100ma, i o 1, i o 7 = 0a *4 v o 1-0.45 v o 1-0.2 v acc output voltage i o 8 v o 8 4.55 100 ma *3 : when a component with a resistance accuracy of 1% is used when a component wi th a resistance accuracy of 0.5% is used, v o 3? is 8.67v 9.0v 9.33v. *4 : since the sw 5.7v and acc 5.7v are output from v dd 5.7v through the sw, the voltage drops by an amo unt equivalent to the on resistance of the sw.
LV5681P no.a1902-4/14 package dimensions unit : mm (typ) ? allowable power dissipation derating curve 3395 ? waveform applied during surge test sanyo : hzip15j 21.6 (20.0) (14.55) (11.0) (9.05) heat spreader (15.8) (r1.75) (9.6) 3.0 17.9 12.4 3.35 0.7 2.54 2.54 1.27 (1.91) 115 0.4 heat sink 100msec 5msec 16v 50v 10% 90% 0 7 2 1 1.5 4 3 5 5.6 6 8 0 20 140 150 80 100 60 120 40 160 aluminum heat sink (50 50 1.5mm 3 ) when using pd max -- ta ambient temperature, ta -- c allowable power dissipation, pd max -- w independent ic aluminum heat sink mounting conditions tightening torque : 39n ? cm, using silicone grease
LV5681P no.a1902-5/14 block diagram pin function pin no. pin name description equivalent circuit 1 ilm ilm output pin on when ctrl1 = m1, m2, h 8.0 to12.0v/300ma 7 9 v cc gnd 1 2 2 ilm_f ilm output voltage adjustment pin continued on next page. + + - 15 7 c3 d2 ext out + 14 c4 d4 d3 d1 300ma 350ma + 1 2 c5 r1 c6 300ma ilm_f + - + - + 5 13 4 3 c7 r3 r4 c8 300ma audio_f + c9 c10 1300ma 11 10 9 6 + - 12 thermal shut down output control 8 + c11 c12 200ma 200ma 100ma + c1 +b c2 v cc gnd acc ant out start up vref output current limit circuit over voltage protection + - r2 ctrl1 (four-value control) ctrl2 (three-value control) remote ext(v cc -0.5v) ant remote (v cc -0.5v) ilm output (8v to 12v) audio output (8v to 9v) cd output (7v) v dd output (5.7v) sw output (5.7v) acc output (5.7v)
LV5681P no.a1902-6/14 continued from preceding page. pin no. pin name description equivalent circuit 3 cd cd output pin on when ctrl2 = m, h 7.0v/1.3a 7 9 v cc gnd 3 4 audio_f auido output voltage adjustment pin 7 9 v cc gnd 5 4 5 audio audio output pin on when ctrl2 = m, h 8.0 to 9.0v/300ma 6 ctrl2 ctrl2 input pin three-value input 500k v cc 7 9 gnd 6 7 v cc supply terminal 8 ctrl1 ctrl1 input pin four-value input 500k v cc 7 9 gnd 8 9 gnd gnd pin continued on next page.
LV5681P no.a1902-7/14 continued from preceding page. pin no. pin name description equivalent circuit 10 acc accessory input 7 9 v cc gnd 15k 45k 10 11 acc5v accessory detection output on when acc > 3v 7 9 v cc gnd 12 11 13 12 v dd 5v v dd 5.7v output pin 5.7v/500ma 13 sw5v sw5.7v output pin on when ctrl2 = m, h 14 ant ant output pin on when ctrl1 = h v cc -0.5v/300ma 7 9 v cc gnd 14 15 ext ext output pin on when ctrl1 = m2, h v cc -0.5v/350ma 7 9 v cc gnd 15
LV5681P no.a1902-8/14 ctrl pin output truth table ctrl1 ant ext ilm ctrl2 cd audio sw5 l off off off l off off off m1 off off on m off on on m2 off on on h on on on h on on on timing chart 21v 2.7v 3.0v v cc (pin 7) v dd 5.7v output (pin 12) cd output (pin 3) audio output (pin 5) ilm output (pin 1) ext output (pin 15) ant output (pin 14) sw5.7v output (pin 13) ctrl1 input (pin 8) ctrl2 input (pin 6) acc input (pin 10) acc output (pin 11)
LV5681P no.a1902-9/14 recommended operation circuit peripheral parts list name of part description recommended value remarks c1 power supply bypass capacitor 100 f or more these capacitors must be placed near the v cc and gnd pins. c2 oscillation prevention capacitor 0.22 f or more c3 ext output stabiliz ation capacitor 2.2 f or more c4 ant output stabilization capacitor 2.2 f or more c5, c57 c9, c11 output stabilization capacitor 4.7 f or more electrolytic capacitor * c6, c8, c10, c12 output stabilization capacitor 0.22 f or more ceramic capacitor * r1,r2 resistor for ilm voltage adjustment r1/r2 :30k /5.6k = 8.0v :27k /3.9k = 10.0v :33k /3.9k = 11.9v a resistor with resistance accuracy as low as less than 1% must be used. r3, r4 resistor for audio voltage setting r3/r4 :30k /5.6k = 8.0v :27k /4.7k = 8.5v :24k /3.9k = 9.0v a resistor with resistance accuracy as low as less than 1% must be used. d1, d2, d3, d4 diode for internal device breakdown protection * : in order to stabilize the regulator ou tputs, it is recommended that the electrolyt ic capacitor and ceramic capacitor be con nected in parallel. furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulat or, so oscillation may occur during an overcurrent protection operation. + + 14 ant 12 v dd 5.7v 10 acc 8 ctrl1 6 ctrl2 4 audio_f 2 15 13 11 9 7 5 3 1 ilm_f ext sw5.7v acc5.7v gnd v cc audio cd ilm + c5 c6 ilm + c11 c12 r4 cd ctrl2 ctrl1 acc acc5.7v sw5.7v r1 r3 + c11 d4 c4 c3 d3 d2 d1 c12 v dd 5.7v ant ext + c7 c8 audio + c1 c2 v cc r2
LV5681P no.a1902-10/14 ? audio/ilm output voltage setting method formula for audio voltage calculation the circuit must be designed in such a way that the r1:r2 ratio satisfies the formula given above for the audio voltage that has been set. example : audio = 8.5v setting method the audio_f voltage is determined by the internal band gap voltage of the ic (typ = 1.26v). the ilm output voltage can be set by the above-mentioned method. note : in the above, the typical values are given in all instances for the values used and, as such, they will vary due to the effects of production-related variations of the ic and external resistors. v v v audio 8.49 1.26 5.74 1.26 ? + = audio audio_f r1 1.26v r2 5 4 ] 1.26[ ] 1.26[ 1 2 v r r v audio + = ( ) 1.26 1.26 2 1 ? = audio r r ( ) 5.75 1.26 1.26 8.5 2 1 ? ? = r r 5.74 ? 4.7 ? 27 2 1 ? = k k r r
LV5681P ps no.a1902-11/14 ? ctrl1 application circuit example (1) 3.3v input: r1 = 4.7k , r2 = 10k a b ctrl1 0v 0v 0v 0v 3.3v 1.05v 3.3v 0v 2.23v 3.3v 3.3v 3.20v ? ctrl2 application circuit example (1) 3.3v input: r3 = r4 = 4.7k a b ctrl2 0v 0v 0v 0v 3.3v 1.61v 3.3v 0v 1.61v 3.3v 3.3v 3.29v caution for implementing LV5681P to a system board in hzip15j, the package used in this ic, there are several meta l exposure other than the connectio n pins and heat-sinks as show n in the following diagrams. in the diagrams, the electric potential of 2 and 3 are the same as pin15 and pin1, respectively. 2 (=pi n15) is ext pin and 3 (=pin1) is ilm output (regulator). when the ic is implemented to the system, make sure that no attachment clamp touches the exposed pin1/ pin15. when the exposed pin1/ pin15 touch the attach ment clamp (sam e electrical poten tial as gnd), il m output or vcc enter th e same state as time when gnd was shor ted. the electric pote ntial of the exposed me tal connected to heat- sinks 1 is the same as that of sub board of the ic (gnd). therefore, even if the exposed metal and gnd of the system board are adjace nt to each other, there should be no problem. ? hzip15j external view ctrl1 r1 a b r2 500k ctrl2 r3 r4 500k c d 1 2 3 1 1 heat-sink same potential 15pin same potential 1pin same potential heat-sink same potential heat-sink side :metal exposure heat-sink side heat-sink same potential :metal exposure
LV5681P ps no.a1902-12/14 ? frame diagram (LV5681P) *in the system power s upply other than LV5681P, pin assignment may differ. 1pin 15pin metal exposure 1 metal exposure 3 metal exposure 2 metal exposure 1 metal exposure 1 metal exposure 1 lv5681
LV5681P ps no.a1902-13/14 hzip15j heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrench es should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. sanyo recommends yg-6260 (momentive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconducto r device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreas onable mechanical stress is not app lied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displ acement due to fluctuation of the spring force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV5681P ps no.a1902-14/14 this catalog provides information as of december, 2010. specifications and inform ation herein are subject to change without notice. this catalog provides information as of october, 2011. specifications and information herein are subject to change without notice. sanyo semiconductor co.,ltd. assumes no responsib ility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein. sanyo semiconductor co.,ltd. strives to supply high-quality high-reliab ility pr oducts, however, any and all semiconductor products fail or malfunction with some probab ility. it is possible that these pr obab ilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause dam age to other property. when designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of sanyo semiconductor co.,ltd. or any third party. sanyo semiconductor co.,ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equip ment, refer to the "delivery specification" for the sanyo semiconductor co.,ltd. product that you intend to use. in the event that any or all sanyo semiconductor co.,ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of sanyo semiconductor co.,ltd.

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